Abstract
Nowadays achieving sustainable development is a global concern. Economic and environmental sustainability can be driven by assessing and improving industrial production system’s performance. An evaluation that assesses if materials, energy and resources are used to their full potential is a powerful tool for improving economic and environmental performance, and consequently supports the identification of all types of waste and inefficiencies along the production system. The goal of this work is to assess overall production system’s efficiency and eco-efficiency using Multi Layer Stream Mapping (MSM). The outputs of this approach is used to scrutinize “where” and “how much” can a unit process and/or a production system improve its financial, environmental and overall efficiency, thereby being of great importance for decision-making and correct implementation of improvement actions. This paper highlights the results from the application of the MSM methodology in a real industrial case regarding a painting unit.

Abstract
Objectives: To describe the results of the acoustic analysis of a database of 90 voice samples with distinct dysphonia levels, using four different - commercial and open source - software programs. Study design: Exploratory, transversal. Methods: The samples were analyzed by four different types of software programs that perform acoustical evaluation - one open source software (Praat) and three commercial ones (Multi Dimensional Voice Program - MDVP by Kay Elemetrics; VoiceStudio by Seegnal; and Dr. Speech by Tiger Electronics) - for comparison among the most commonly used acoustic measures (frequency, perturbation and noise measures). Results: There is a moderate to strong,correlation, positive and statistically significant among the software programs. The mean FO is not statistically different among the used applications. The other acoustic measures revealed statistically significant differences. Conclusion: Even though it is easier to access software programs and there are numerous proposals for acoustic measures, not all of them are statistically representative nor have numeric semblance among the different applications.

Abstract
Purpose The purpose of this study is to first investigate the efficiency of the most commonly used performance measures for minimizing the number of workstations (NWs) in approaches addressing simple assembly line balancing problem (SALBP) for both straight and U-shaped line, and second to provide a comparative evaluation of 20 constructive heuristics to find solutions to the SALBP-1. Design/methodology/approach A total of 200 problems are solved by 20 different constructive heuristics for both straight and U-shaped assembly line. Moreover, several comparisons have been made to evaluate the performance of constructive heuristics. Findings Minimizing the smoothness index is not necessarily equivalent to minimizing the NWs; therefore, it should not be used as the fitness function in approaches addressing the SALBP-1. Line efficiency and the idle time are indeed reliable performance measures for minimizing the NWs. The most promising heuristics for straight and U-shaped line configurations for SALBP-1 are also ranked and introduced. Practical implications Results are expected to help scholars and industrial practitioners to better design effective solution methods for having the most balanced assembly line. This study will further help with choosing the most proper heuristic with regard to the problem specifications and line configuration. Originality/value There is limited research assessing the efficiency of the common objectives for SALBP-1. This study is among the first to prove that minimizing the workload smoothness is not equivalent to minimizing the NWs in SALBP-1 studies. This work is also one of the first attempts for evaluating the constructive heuristics for both straight and U-shaped line configurations.

Abstract
Electrical distribution systems are facing new challenges mainly due to the growing penetration of distributed generation of mainly intermittent nature such as wind and solar PV. As a result, these systems need to undergo massive transformations in terms of operational scheme. In other words, new operational strategies, which increase the flexibility of distribution systems, have to be put in place. This is highly required if distribution systems are to support large quantities of variable RES power. One plausible strategy worth considering relates to the meshed operation of such systems. The main topic of this paper revolves around the prospects of operating distribution grids in a meshed manner. The benefits are quantified in terms of added flexibility to the system, and vRES utilization levels. A mixed integer linear programming model is employed to perform the required analysis, and a 119-bus distribution system is used for this purpose. The analysis of the results generally shows the strong viability of the new operation strategy in terms of adding flexibility and scaling up the utilization level of variable RES power in the considered system. This strategy can be considered as a viable flexibility option that enables further integration of intermittent power sources.

Abstract
The development of Low-Density Fan-Out (LDFO), formerly Wafer Level Fan-Out (WLFO), platforms to encompass the requirements of potential new markets and applications such as the Internet of Things (IoT) is crucial to maintain LDFO as the leading Fan-Out technology. This drives the development of a new set of capabilities in the current standard LDFO process flow to break through the existing technology boundaries. One of the most widely discussed advantages of LDFO packaging is heterogeneous high-density system integration in a package. LDFO System in Package (LDFO SiP) integrates active dies, passive components and even already-packaged components using other packaging technologies. This heterogeneous integration is based on a wide range of different geometries and materials placed inside the LDFOSiP with high accuracy. Ultimately, heterogeneous integration will be fundamental to achieve new levels of miniaturization. However, multi-die solutions face several challenges such as bare-die availability, passives integration, antenna integration, low power budget, test complexity and reliability. Package research and development (R&D) must overcome all of these issues to build a product with high volume manufacturability. The wafer level SiP (WLSiP) technology required to enable the new features and processes needs to be ready for high volume manufacturing of new products at high yield and reasonable cost. This paper presents the approaches used to effectively enable LDFO SiPs (WLSiPs): 1. A pre-formed vias solution is employed to connect front to back side of the package, including development for high accuracy via bar placement. 2. A wafer front-side to back-side redistribution layer (RDL) alignment solution was developed. 3. Space requirement reduction between components to achieve the smallest possible package. 4. Miniaturized Bluetooth antenna integration in the RDL. 5. Creation of a stacking concept (vertical connections to create a modular system that enables easy addition of new features to the final product). Inside the package (excluding the area reserved for the antenna), components are densely packed: several sensors, power management components, radio communication and all required passives are incorporated into a single WLSiP. Connecting all these features to create a component that works by connecting only a single battery required implementing a double sided, multi-layer RDL, while maintaining the ability to create a 3D solution by stacking vertical connections for several other solutions. The result is an approach that easily adapts the system to a variety of customers' needs. The work done is part of the collaborative COMPETE2020-PT2020 funding program under "IoTiP-Internet of Thing in Package" project no 017763, Projetos de I&DT Empresas em CoPromocao.

Abstract
Industrial Symbiosis (IS) envisages a collaborative approach to resource efficiency, encouraging companies to recover, reprocess and reuse waste within the industrial network. Several challenges regarding the effective application of IS continue to limit a broader implementation of this area of Industrial Ecology. The MAESTRI project encompasses an Industrial Symbiosis approach within the scope of sustainable manufacturing for process industries that fosters the sharing of resources (energy, water, residues, etc.) between different processes of a single company or between multiple companies. The Industrial Symbiosis approach is integrated with Efficiency Framework in the so-called MAESTRI Total Efficiency Framework. Efficiency Framework is devoted to the combination of eco-efficiency (via ecoPROSYS) and the efficiency assessment (via MSM - Multi-Layer Stream Mapping). In this manuscript the benefit of the combination of the Efficiency Framework as an facilitator to a more effective application of Industrial Symbiosis, within or outside the company's boundaries, is explored.