Abstract
The development of Low-Density Fan-Out (LDFO), formerly Wafer Level Fan-Out (WLFO), platforms to encompass the requirements of potential new markets and applications such as the Internet of Things (IoT) is crucial to maintain LDFO as the leading Fan-Out technology. This drives the development of a new set of capabilities in the current standard LDFO process flow to break through the existing technology boundaries. One of the most widely discussed advantages of LDFO packaging is heterogeneous high-density system integration in a package. LDFO System in Package (LDFO SiP) integrates active dies, passive components and even already-packaged components using other packaging technologies. This heterogeneous integration is based on a wide range of different geometries and materials placed inside the LDFOSiP with high accuracy. Ultimately, heterogeneous integration will be fundamental to achieve new levels of miniaturization. However, multi-die solutions face several challenges such as bare-die availability, passives integration, antenna integration, low power budget, test complexity and reliability. Package research and development (R&D) must overcome all of these issues to build a product with high volume manufacturability. The wafer level SiP (WLSiP) technology required to enable the new features and processes needs to be ready for high volume manufacturing of new products at high yield and reasonable cost. This paper presents the approaches used to effectively enable LDFO SiPs (WLSiPs): 1. A pre-formed vias solution is employed to connect front to back side of the package, including development for high accuracy via bar placement. 2. A wafer front-side to back-side redistribution layer (RDL) alignment solution was developed. 3. Space requirement reduction between components to achieve the smallest possible package. 4. Miniaturized Bluetooth antenna integration in the RDL. 5. Creation of a stacking concept (vertical connections to create a modular system that enables easy addition of new features to the final product). Inside the package (excluding the area reserved for the antenna), components are densely packed: several sensors, power management components, radio communication and all required passives are incorporated into a single WLSiP. Connecting all these features to create a component that works by connecting only a single battery required implementing a double sided, multi-layer RDL, while maintaining the ability to create a 3D solution by stacking vertical connections for several other solutions. The result is an approach that easily adapts the system to a variety of customers' needs. The work done is part of the collaborative COMPETE2020-PT2020 funding program under "IoTiP-Internet of Thing in Package" project no 017763, Projetos de I&DT Empresas em CoPromocao.

Abstract
In this letter, a packaged compact meander-line monopole antenna for Bluetooth communications, manufactured in low-density fan-out technology, is presented. A combined size for the antenna and ground plane of 0.1 lambda(0) x 0.06 lambda(0) x 0.008 lambda(0) is obtained. Such small antennas are usually designed considering their connection to an evaluation board with a large ground plane, which improves their gain and bandwidth, but in this letter, the antenna is designed so it can work standalone without any further connection to printed circuit boards. The challenge of designing such a compact antenna is surpassed by performing a detailed modeling of the radiating meander-line element altogether with its finite ground plane, a tuning inductor, and an inductive coupling feed. The antenna model is developed in Ansys HFSS using the finite element method, which is later validated experimentally. Measurements of the return loss radiation pattern are carried out, and final results show a -6 dB bandwidth of approximately 110 MHz and a gain of -8.7 dBi, at 2.42 GHz.

Abstract
In this paper we propose a high-gaussicity spline-profiled horn antenna, which is scalable in length and aperture to achieve higher gains whilst retaining a high Gaussian efficiency. A novel approach is used where a PSO is used for optimizing the spline, using the gaussicities at the operating frequencies as the objective function, which further improves side-lobe level and cross-polarization when compared to the state-of-the-art. With the proposed method, which was validated through FEM simulations in HFSS, reflection coefficients below -15 dB, gains greater than 25 dBi and gaussicities above 91% were obtained in the entire WR-3 band.

Abstract
In this paper, we describe the design of a dual polarized packaged patch antenna for 5G communications with improved isolation and bandwidth for K-band. We introduce a differential feeding technique and a heuristic-based design of a matching network applied to a single layer patch antenna with parasitic elements. This approach resulted in broader bandwidth, reduced layer count, improved isolation and radiation pattern stability. The results were validated through finite element method (FEM) and method of moments (MoM) simulations. A peak gain of 5 dBi, isolation above 40 dB and a radiation efficiency of 60% were obtained.

Abstract
In this paper, we describe the design of an electrically large anechoic chamber for usage on millimetre-wave bands. Ansys Savant sotware was used to perform a simulation of the chamber, using physical optics coupled with uniform theory of diffraction (PO/UTD). Moreover, a method based on an open waveguide probe is described in this paper to obtain the electrical properties of the RF absorbers at millimetre-wave frequencies. Two different source antennas were simulated in this work and the corresponding quiet zones predicted. The largest quiet zone was 30 mm x 30 mm x 50mm, for a chamber size of 1.2 m x 0.6 m x 0.6 m.